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Ultrasonic phased array testing is a powerful non-destructive testing (NDT) technology which is growing rapidly.
Time of Flight Diffraction is a reliable method of non-destructive ultrasonic testing used to look for flaws in welds. In Time of Flight Diffraction (TOFD) systems, a pair of ultrasonic probes reside on opposite sides of a weld-joint or area of interest. A transmitter probe emits an ultrasonic pulse, which is captured by the receiver probe on the opposite side. In an undamaged part, the signals picked up by the receiver probe are from two waves: one that travels along the surface (lateral wave) and one that reflects off the far wall (back-wall reflection). When a discontinuity such as a crack is present, there is a diffraction of the ultrasonic sound wave from the top and bottom tips of the crack. Using the measured time of flight of the pulse, the depth of the crack tips can be calculated automatically by trigonometry. This method is more reliable than traditional radiographic, pulse echo manual UT (Ultrasonic Testing) and automated UT weld testing methods.
In the previous two blog posts the physical basis of piezoelectricity and the main groups of materials were presented, focusing on the selection of a material for a specific purpose. In this blog post we discuss in what configuration piezoelectric materials can be used and illustrate some example device structures.
In the previous blog post a grouping of piezoelectric materials was given into three categories: crystalline structures, engineered perovskite-like ceramics, and polymers. In this blog post a comparison of these groups is provided to aid the reader choosing a suitable material for a specific application.
In this first blog post of the piezoelectrics series, a brief overview is provided on the fundamentals of the phenomenon. Piezoelectric materials allow conversion of energy from the mechanical domain to the electrical domain and vice versa. They can be used to create various sensors or actuators: applied periodic electrical signal can result in the generation of ultrasonic waves for imaging purposes; stresses, such as observed for a cantilever suspending a mass in an accelerometer can be translated to electrical signals.
We’ve created some simulation guides to help you quickly start simulating in OnScale. You’ll find examples for key applications including MEMs, NDT, RF Sensors, Flow and Biomedical. You can check them all out here!
When I joined OnScale I had just graduated from university. I’ve got to admit, straight out of university a lot about the world of Computer Aided Engineering (CAE) and Finite Element Analysis (FEA) was still a mystery to me. FEA is a fascinating area -- but I think it’s fair to say that it can at times seem daunting to beginners!
In this blog post, we'll have a look at some of the basics of electronic resonators such as: what is a resonator, the types of resonators that are most used on the market, the basic physical principles, the most important characteristics, and how to get all of that with simulation using OnScale.
In this article, we will discuss the issues the MEMS industry faces with packaging and how OnScale can be used to simulate a wide range of packaging effects.
Traditional high data rate communication realized by electric components – such as A/D converters, encoders, modulators, amplifiers, processors and similar integrated circuits – faces a challenge as further increase of frequency would result in cooling problems due to the generated amount of thermal energy in the form of Joule heating. An alternative approach is light-based information transfer in guided structures, such as optical fibers. However, optical fibers occupy relatively large spaces due to the limited minimum size of bends allowed by the small refractive index difference between the wave guiding core and the outer cladding.